![]() Standards such as the IEEE-1149.5 module test and maintenance bus standard in 1995 and the IEEE-1149.4 standard for mixed-signal testing in 1999 were met with low adoption rates and are not widely used at present. The lessons that were learned became formalized in an update to the core standard in 2001 and IEEE-1149.1-2001 was published.Īs new applications of JTAG were discovered, new standards were developed to extend the capabilities of JTAG. An additional supplement, 1149.1b, was published in 1994 to add Boundary-Scan Description Language (BSDL) to the standard, paving the way for fast, automated test development and spurring continuous adoption by major electronics producers all over the world. A few years later in 1993, a new revision to the standard-1149.1a-was introduced to clarify, correct, and enhance the original specification. ![]() In the 1980s, the Joint Test Action Group (JTAG) set out to develop a specification for boundary-scan testing that was standardized in 1990 as the IEEE Std. JTAG and its related standards have been and will continue to be extended to address additional challenges in electronic test and manufacturing, including test of 3D ICs and complex, hierarchical systems. Today, JTAG is used for everything from testing interconnects and functionality on ICs to programming flash memory of systems deployed in the field and everything in-between. JTAG/boundary-scan presented an elegant solution to this problem: build functionality into the IC to assist in testing assembled electronic systems. These new technology developments led to dramatic increases in costs related to designing and building bed of nails fixtures at the same time, circuit board test coverage also suffered. Packaging formats, specifically Ball Grid Array (BGA, depicted in Figure 1) and other fine pitch components, designed to meet ever-increasing physical space constraints, also led to a loss of physical access to signals. As PCBs grew in complexity and density-a trend that continues today-limitations in the traditional test methods of in-circuit testers (ICTs) and bed of nails fixtures became evident. JTAG is commonly referred to as boundary-scan and defined by the Institute of Electrical and Electronic Engineers (IEEE) 1149.1, which originally began as an integrated method for testing interconnects on printed circuit boards (PCBs) implemented at the integrated circuit (IC) level. BGA faults are difficult to detect and diagnose without JTAG JTAG Boundary-Scan & JET Technology Benefits FAQįigure 1.Training and Seminars 2023: Embedded Hardware Systems Test with IEEE-1149.x and Beyond.On-site JTAG Boundary-Scan Training Classes.Test Genie: Turnkey Boundary-Scan Solution.Development Station (Boundary-Scan & ISP Only).Controllers for High-Volume Production Systems.
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